DySPAN Paper Invited for Submisssion to TCCN

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2018 DySPAN paper was invited for submission to IEEE Transactions on Cognitive Communications and Networking (TCCN) for a special issue featuring the top papers from this year’s conference. We accepted the invitation and have made improvements to the paper including additional simulations focusing on new topologies. We submitted the updated manuscript to the journal yesterday, and it is targeted for publication in June 2019 pending the review process.